Whether you need 10 or 10,000 pieces, our precision wafer-based processes result in high yields and competitive costs, especially at higher volumes. These high-quality custom optics and optical assemblies combine our IBS coatings, ultraprecise fabrication capabilities and epoxy-free, bonding technology—Chemically Activated Direct Bonding™ (CADB®) to produce components which are widely used in the telecommunications, semi-conductor and biomedical industries.
These assemblies are ideal for increasing the sensitivity in beam-delivery micro-systems, fiber-optic, and endoscopic systems used in fluorescence spectroscopy, Raman spectroscopy, optical-coherence tomography (OCT), multiphoton microscopy (MPM) and confocal microscopy. Because of their miniature size, they can be placed right at the objective lens or at the tip of optical fibers and light pipes.
Typical Micro-Optics Characteristics
|UV, Visible, NIR, telecom bands, MWIR (250–5000 nm)|
|down to ±25 µm|
|Angle Tolerance||±1 minute standard|
|Typical Insertion Loss||<0.5% (two facet device)|
|Substrate Material||Fused silica, BK7, Zerodur, LaSFN9, optical-grade silicon, MgF2, ULE, YAG, and other optical glasses and crystals|
|Size||From less than 1 mm to 150 mm|