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YAG Chip Laser with Cladding on All Sides

This high-power yttrium aluminum garnet (YAG or Y3Al5O12) chip laser is a completely adhesive-free assembly comprised of several doped YAG and sapphire components. Manufactured using our proprietary CADB® bonding process and advanced polishing techniques, this part required several iterative processing steps, thus highlighting the importance of robust, durable bonds and meticulous cleaning and handling techniques. PPC succeeded in polishing each of the sapphire and YAG elements to the flatness and 10-5 level surface quality necessary for a high energy optical assembly. From the raw material specifications through the final metrology, we worked together with the customer to meet their budgetary requirements and performance expectations for the final, coated assembly.

Built in collaboration with the Engineering Research Center for Extreme Ultraviolet (EUV) Science and Technology and Colorado State University.
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