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Monolithic Assemblies with λ/20 TWD


Transmitted wavefront distortion (TWD) through a 12.7 mm beamsplitter cube taken over a clear aperture of 85%. The data shows a wavefront error of less than λ/20 peak-to-valley and less than λ/100 RMS at 633 nm.

We routinely produce optically bonded assemblies with less than 0.10 waves of transmitted wavefront distortion (TWD) peak-to-valley. λ/10 wavefronts are fairly common on single optical components, but when you build multi-element optic assemblies, these distortions can compound, resulting in much higher levelso f distortion. With our nanometer-level tolerances, IBS coatings, and unique zero-bond-length adhesive-free CADB® bonding process, our monolithic optical assemblies consistently exceed even the most stringent specifications. Requests currently being met include λ/20 peak-to-valley TWD, beam deviation less than 30 arcseconds and optical path lengths matched to better than 10 microns.

With CADB, we can bond a variety of materials including fused silica, silicon, doped and undoped YAG, YVO4, phosphate glasses, KTP, spinel and sapphire.

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Transmitted wavefront distortion (TWD) through a 12.7 mm beamsplitter cube taken over a clear aperture of 85%. The data shows a wavefront error of less than λ/20 peak-to-valley and less than λ/100 RMS at 633 nm.
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